Computational Study of the Thermodynamic Properties of Some Lead-free Solder Alloys

Authors

  • Sanjay Kumar Sah Department of Physics, Birendra Multiple Campus, Tribhuvan University, Bharatpur, Nepal
  • Indu Shekhar Jha Department of Physics, M.M.A.M. Campus, Tribhuvan University, Biratnagar, Nepal
  • Ishwar Koirala Central Department of Physics, Tribhuvan University, Kirtipur, Kathmandu, Nepal

DOI:

https://doi.org/10.3126/bmcjsr.v5i1.50676

Keywords:

Activity, Molecular Interaction Volume Model, Excess Gibbs free energy, Binary liquid alloys, Ternary liquid alloys.

Abstract

Activities of the components of the binary lead-free solder alloys Cu-Sn, and Ag-Cu were computed using the molecular interaction volume model (MIVM). The theoretical data have been compared with the corresponding experimental values. For the validity of the model parameters, the excess Gibbs free energy of mixing of Cu-Sn, and Ag-Cu liquid alloys have been determined and compared with the corresponding experimental data available in the literature. Similarly, the activities of Sn in ternary liquid alloys Sn-Ag-Cu were computed and examined with the available experimental data at 1000 K. It has been observed that the calculated activities of the components of the binary and ternary solder alloys have nearly the same tendency as the experimental data.

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Author Biography

Sanjay Kumar Sah, Department of Physics, Birendra Multiple Campus, Tribhuvan University, Bharatpur, Nepal

Central Department of Physics, Tribhuvan University, Kirtipur, Kathmandu, Nepal

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Published

2022-12-31

How to Cite

Sah, S. K., Jha, I. S., & Koirala, I. (2022). Computational Study of the Thermodynamic Properties of Some Lead-free Solder Alloys. BMC Journal of Scientific Research, 5(1), 69–79. https://doi.org/10.3126/bmcjsr.v5i1.50676

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Section

Research Article